Work packages

WP 1 : Specifications
WP 2 : Microdisplay design
WP 3 : Microdisplay chip processing
WP 4 : LC assembly and technology
WP 5 : Microdisplay chip packaging
WP 6 : Validation and assessment 
WP 7 : Dissemination and exploitation
WP 8 : Demonstration activities
WP 9 : Management and coordination

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